Mazusho Strain Gage Testing: Standardization This standard addresses the development and application for shock testing to surface mount components PCBs. This data also can aid board designers when placing critical packages. Amazon Rapids Fun stories for kids on the go. Removing components can alter the mechanical response of the board, repositioning gages can result in irrelevant strain. Withoutabox Submit to Film Festivals.
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Juzshura As awareness increases, it becomes obvious that SGT is a necessary tool for test-fixture vendors. Would you like to tell us about a lower price? With the recognition that a growing need exists for the SGT of PCBAs, manufacturers of strain gages and related instruments have been developing products including applications know-how to meet the needs of users in this industry.
Strain Gage Testing: Standardization Smaller gage sizes can be more susceptible to variations in the board structure and localized strain concentration. Shopbop Designer Fashion Brands. This ranges from multiple high-acceleration shocks experienced by handheld devices to shipping-shock impulses on expensive enterprise infrastructure equipment. Read more Read less. Standardization December 31, Related Video Included. Perhaps the most jpc area of development is that of real estate, particularly in mobile computing platforms and small consumer devices.
Concerns about second-level interconnect SLI failures due excessive flexure during board- and system-level assembly and test operations increase with the use of finer-pitch BGA components, thinner PCBs and lead-free interconnects Figure 1.
The high strain imposed by clamps and test probes often make test fixtures a major culprit of solder-joint fracture due to excessive board flexure. Partial cracking, however, is not detected easily with non-destructive testing, and often appears only in field returns.
When paired with computational analysis techniques, SGT provides insights on ilc stresses that critical packages are subjected to during such conditions. Data are being accumulated by the industry on the reliability of components that are subjected to the higher soldering temperatures for SAC. Write a customer review.
It is clear that more research is required before the industry can agree on a common approach to strain limits. Amazon Restaurants Food delivery from local restaurants. Manufacturers also have been aggressively developing SGT capability and consistent processes for use across their factories.
Removing components can alter the mechanical response of the ippc, repositioning gages can result in irrelevant strain. Amazon Drive Cloud storage from Amazon. Discover Prime Book Box for Kids. Research is still on-going to assess whether SAC may be more fragile due to the formation of the interfacial intermetallics and the associated existence of Kirkendall voids near the interface. Mudasir Ahmad, manufacturing engineer, Cisco Systems, be contacted at ; mudasir.
Most rely on customers to conduct these tests Figure 3. For many vendors, cost is an important factor when implementing routine SGT on their fixtures. Strain gage instrumented test board. Another benefit of SGT standardization is that it helps baseline typical strain readings observed during each assembly step. Board-flexure control using gage measurement has proven effective in preventing these occurrences, and continues to gain acceptance as a method to identify stressful processes during manufacturing, handling, testing and assembly.
In addition to BGA components, SGT also is an invaluable tool for analyzing failures on other discrete surface mount devices, such as capacitors and resistors. This information is critical for EMS providers and their customers as it provides assurance of a safe assembly process. IPC Mechanical shock test for solder joint reliability — Scanditron As we approach ipf July lead-free deadline, the transition to lead-free processes continues to cause anxiety. Efforts to reduce the cost of testing will ease adoption by smaller companies.
Share your thoughts with other customers. Get to Know Us. In addition to isolating potentially problematic operations, SGT that processes are operating within allowable strain levels. Explore the Home Gift Guide. With increased utilization of strain measurement in electronics manufacturing, different SGT methodologies have been developed.
This standardization effort has allowed the creation of a central database of SGT results with the long-term goal of developing better test fixture, PCB layout and process setup methods and guidelines.
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability